Iezekiel, S. ed.
Microwave Photonics
Devices and Applications
（マイクロ波光工学）
Wiley-IEEE Press 2009.5
360 pp.(H)
ISBN 0-470-84854-5
13,700円
Contents
1.Introduction to Microwave Photonics/ 2.Component Technologies/ 3.Systems Applications/ Index/
* Opening with an overview to the subject, this book covers direct modulation, photonic oscillators for THz signal generation, and terahertz sources. It takes a unique application- focused approach and describes: ・analogue fibre-optic links; ・fibre radio technology; ・microwave photonic signal processing; ・measurement of microwave photonic components, and; ・biomedical applications.
* This text is ideal for practising microwave and fibre optics communication engineers wishing to improve their knowledge, and for researchers and graduate students wanting an overview of the subject. *
Bahl, I.
Fundamentals of RF and Microwave Transistor Amplifiers
高周波およびマイクロ波トランジスタ増幅器の基礎
John Wiley & Sons 2009.6
671 pp.(H)
ISBN 0-470-39166-9
16,500円
Contents
1.Introduction/ 2.Linear Network Analysis/ 3.Amplifier Characteristics and Definitions/ 4.Transistors/ 5.Transistor Models/ 6.Matching Network Components/ 7.Impedance Matching Techniques/ 8.Amplifier Classes and Analyses/ 9.Amplifier Design Methods/ 10.High-Efficiency Amplifier Techniques/ 11.Broadband Amplifier Techniques/ 12.Linearization Techniques/ 13.High Voltage Power Amplifier Design/ 14.Hybrid Amplifiers/ 15.Monolithic Amplifiers/ 16.Thermal Design/ 17.Stability Analyses/ 18.Biasing Networks/ 19.Power Combining/ 20.Integrated Function Amplifiers/ 21.Amplifier Packages/ 22.Transistor and Amplifier Measurements/ Appendix: A: Physical Constants and Other Data/ B: Units and Symbols/ C: Frequency Band Designation/ D: Decibel Units - DB/ E: Mathematical Relations/ F: Smith Chart/ G: Graphical Symbols/ H: Acronyms and Abbreviations/ I: List Of Symbols/ J: Multiple Access and Modulation Techniques/ Index/ *
Gevorgian, S. et al.
Ferroelectrics in Microwave Devices, Circuits and Systems
Physics, Modeling, Fabrication and Measurements
（マイクロ波デバイス、回路、システムにおける強誘電体）
Springer-Verlag 2009.6
394 pp.(H)
ISBN 1-84882-506-4
21,400円
Contents
1.Introduction: Overview of Agile Microwave Technologies/ 2.Physics of the Tunable Ferroelectric Devices/ 3.Fabrication of Ferroelectric Components and Devices/ 4.Substrates, Varactors and Passive Components/ 5.Ferroelectric Devices/ 6.Circuit and System Applications of Tunable Ferroelectric Devices/ 7.Modeling/ 8.Measurements of the Dielectric Properties/ 9.Potentials and Perspectives/ 10.Concluding Remarks/ References/ Index/
* Today's wireless communications and information systems are heavily based on microwave technology, as are an increasing number of other industry sectors. Extensive research has been carried out into the development of new technologies to meet the increasingly complex requirements of such systems. Among these new technologies agile (tuneable, reconfigurable, and adaptable) microwave components based on ferroelectric materials, have great potential and are already gaining ground. *
Lorence, M. W.n et al. ed.
Development of Packaging and Products for Use in Microwave Ovens
Woodhead Pub. 2009.7
408 pp.(H)
ISBN 1-84569-420-1
35,200円
Contents
1.Principles/ 2.Microwave Packaging Materials and Design/ 3.Product Development, Packaging and Oven Safety/ 4.Modeling of Microwave Heating/ Index/
* Development of packaging and products for use in microwave ovens provides a focused and comprehensive review for developers. Part one discusses the principles of microwave heating and ovens, with an emphasis on the effect of food dielectric properties and geometry on heating uniformity and optimising the flavours and colours of microwave foods. Microwave packaging materials and design are discussed in Part two; chapters cover rigid packaging, susceptors and shielding. Product development, food, packaging and oven safety is the topic of Part three. Computer modelling of microwave products and active packaging is discussed in Part four. *
Manning, T.
Microwave Radio Transmission Design Guide 2nd ed.
Artech House 2009.8
350 pp.(H)
ISBN 1-59693-456-5
13,200円
Contents
1. Introduction/ 2. Link Planning/ 3. Reliability Standards/ 4. Transport Technologies/ 5. Radio Equipment Characteristics/ 6. Microwave Propagation/ 7. Antenna Considerations/ 8. Frequency Planning/ 9. Link Design/ 10. Useful Formulae/ 11. List Acronyms and Abbreviations/ 12. About the Author/ Index/
* The second edition includes a wealth of important updates, including discussions on backhaul capacity limitations, ethernet over radio, details on the latest cellular radio standards (2.5G, 3G, and 4G). You also learn about recent changes in spectrum management, including the availability of unlicensed bands and new mm band frequencies between 70 and 90 GHz. Additionally, you find more details on the fundamentals of antennas, especially at VHF/UHF levels. *
Kuang, K. et al. ed.
RF and Microwave Microelectronics Packaging
Springer-Verlag 2009.11
285 pp.(H)
ISBN 1-4419-0983-4
16,500円
Contents
1. Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies/ 2. Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages/ 3. Polymeric Microelectromechanical MillimeterWave Systems/ 4. Millimeter-Wave Chip-on-Board Integration and Packaging/ 5. Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules/ 6. RF/Microwave Substrate Packaging Roadmap for Portable Devices/ 7. Ceramic Systems in Package for RF and Microwave/ 8. Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications/ 9. LTCC Substrates for RF/MW Application/ 10. High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging/ 11. High Performance Microelectronics Packaging Heat Sink Materials/ 12. Technology Research on AlN 3D MCM/ References/ Index/
* RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. *
Rother, T.
Electromagnetic Wave Scattering on Nonspherical Particles
非球形粒子における電磁波散乱
Springer-Verlag 2009.10
296 pp.(H) + CD-ROM
ISBN 3-642-00703-1
19,400円
Contents
1.Scattering as a Boundary Value Problem/ 2.A Look into the Mathematical Tool Box/ 3.First Approach to the Green Functions: The Rayleigh Method/ 4.Second Approach to the Green Functions: The Self-Consistent Way/ 5.Other Solution Methods/ 6.Rayleigh's Hypothesis/ 7.Physical Basics of Electromagnetic Wave Scattering/ 8.Numerical Simulation of Scattering Experiments/ 9.Recommended Literature/ Index/
* This book gives a detailed overview of the theory of electromagnetic wave scattering on single, homogeneous, but nonspherical particles. A related Green's function formalism is systematically developed which provides a powerful mathematical basis not only for the development of numerical approaches but also to discuss those general aspects like symmetry, unitarity, and the validity of Rayleigh's hypothesis.
* Example simulations are performed in order to demonstrate the usefulness of the developed formalism as well as to introduce the simulation software which is provided on a CD-ROM with the book. *
Yu, W.
Electromagnetic Simulation Techniques Based on the FDTD Method
John Wiley & Sons 2009.9
206 pp.(H)
ISBN 0-470-50203-7
12,800円
Contents
1. Introduction to FDTD Method/ 2. Advanced FDTD Method/ 3. Parallel Computing Techniques/ 4. Electromagnetic Simulation Techniques/ 5. Illustrative Engineering Applications/ 6. Comprihensive Consideration for FDTD Simulation/ References/ Index/
* This is the first publication that guides readers step by step through the implementation of electromagnetic simulation techniques based on FDTD methods. These simulation techniques serve as an essential bridge between FDTD methods and their applications. Moreover, the book helps readers better understand the underlying logic of FDTD methods so that they can design FDTD projects using either commercial electromagnetic software packages or their own codes in order to solve practical engineering problems. *
161-59 登録日 10.02.04
